As process nodes shrink and modern architectures grow exponentially complex, semiconductor design has reached a critical tipping point. The surging demand for advanced CPUs, GPUs, and AI accelerators requires a fundamental shift in how chips, packages, and entire systems are engineered. In this insightful fireside chat, Neil Tyler sits down with Madhuparna Datta to explore how more than two decades of EDA evolution have paved the way for the next major leap in semiconductor innovation.

The conversation delves into the transformative role of artificial intelligence across the entire design lifecycle, from AI-driven design-space exploration, timing closure, and signoff, to system-level optimization spanning silicon, packaging, and board layout. Drawing on real-world customer deployments, Madhuparna will share how AI-enabled tools are drastically accelerating time-to-market while improving silicon quality. Crucially, the session addresses the evolving role of the engineer: will AI act as the ultimate design co-pilot, and what core skills will the next generation need to thrive in an AI-assisted environment?