This presentation will cover PCB layout optimisation for maximum heat dissipation, focusing on design strategies and best practices. It explores tools for identifying thermal issues early in the design stage and techniques to enhance conduction, convection and radiation efficiency. Additionally, it provides insights into ensuring optimal heat transfer from PCB to heatsink. Attendees will gain practical knowledge to improve thermal performance in their designs. Finally, we will be looking at the supporting documentation required as part of the compliance journey when integrating thermal management products.